Forniamo materiali  per evaporazione e targets per la deposizione di film sottili in diverse forme e purezze. Il tipico range di purezza è compreso tra 99,9% e 99,9999%. Le forme includono pezzi, granuli, targets, fili, pellets, barre, polveri e fogli.

I targets sono disponibili anche con backing plates saldate con indio o con colla epossidica a base di argento.

Disponiamo inoltre di una ampia scelta di componenti per sistemi da vuoto.

 

Per scegliere i prodotti collegati al sito della Kurt J. Lesker, uno dei  nostri partner più rinomati di questo settore oppure fai clic su: Target e materiali per evaporazione

Partner of:

LAB EQUIPMENT - Via Tricase, 70 - 73030 - Montesano Salentino - (LE)

Tel. +39 331 5830963 - Fax: +39 0832 1900102 - e-mail: info@labequipment.it

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Our ISO 9001:2008 Materials Group stocks a vast assortment of pure materials for use in thermal evaporation and sputter deposition processes. We offer solid elements, compounds, alloys, intermetallics, and mixtures in a variety of shapes, sizes, and purities for R&D applications. We also offer our materials customers sputter target bonding and precious metals reclamation services, saving you both time and money.

Materials and Purity

The products listed include pure elements, compounds, alloys, intermetallics, and mixtures (elements and/or compounds mixed to the customer-specified atomic-weight percentages).

A film’s purity depends, in part, on the starting material’s purity.

Additional contamination may arise from reaction with air, particle transfer during handling or mounting, residual vapors in the vacuum system, and cross-contamination from other deposition sources. However, no degree of system or handling cleanliness can reduce a film’s contamination due to original material purity.

NOTE: Only the most frequently ordered purities are listed here. If other purity levels are needed, contact the Sales Department.

Some reactive materials are shipped in a light mineral oil coating. It is important to follow a correct cleaning protocol to remove this oil. If the instructions become detached from the material, or were not provided, contact the Sales Department.

TORUS^® Targets

Targets (cathodes) for most TORUS sputter sources are simple disc shapes of constant thickness, listed by their material and diameter. Some older, largediameter TORUS designs require targets that are disc-shaped annuluses.

Bonded targets are thin discs of pure material bonded to an OFHC copper backing plate. Bonded targets are used to reduce target costs in initial deposition tests, particularly for the more expensive materials.

KJLC's Materials Department provides the bonding service or the material discs separately for customers who prefer to provide their own backing plates or bond the target themselves.

Bonded targets are also used in high-power applications where the thinner target offers less thermal resistance and the conductivity of the copper improves conduction to the source's cooling well.

Because the range of possible target shapes and sizes is so vast, we list only discs of uniform thickness. If you don't see a size, shape, or material listed to suit your OEM sputter sources, please contact :

info@labequipment.it

Sputtering targets evaporation materials deposition materials thermal evaporation electron beam evaporation sputtering target

Sputtering targets evaporation materials deposition materials thermal evaporation electron beam evaporation sputtering target

Sputtering targets evaporation materials deposition materials thermal evaporation electron beam evaporation sputtering target

Sputtering targets evaporation materials deposition materials thermal evaporation electron beam evaporation sputtering target

Sputtering targets evaporation materials deposition materials thermal evaporation electron beam evaporation sputtering target

Sputtering targets evaporation materials deposition materials thermal evaporation electron beam evaporation sputtering target

Sputtering targets evaporation materials deposition materials thermal evaporation electron beam evaporation sputtering target

Sputtering targets evaporation materials deposition materials thermal evaporation electron beam evaporation sputtering target

Sputtering targets evaporation materials deposition materials thermal evaporation electron beam evaporation sputtering target

Sputtering targets evaporation materials deposition materials thermal evaporation electron beam evaporation sputtering target

Sputtering targets evaporation materials deposition materials thermal evaporation electron beam evaporation sputtering target

Sputtering targets evaporation materials deposition materials thermal evaporation electron beam evaporation sputtering target

Sputtering targets evaporation materials deposition materials thermal evaporation electron beam evaporation sputtering target

Sputtering targets evaporation materials deposition materials thermal evaporation electron beam evaporation sputtering target

Sputtering targets evaporation materials deposition materials thermal evaporation electron beam evaporation sputtering target

Sputtering targets evaporation materials deposition materials thermal evaporation electron beam evaporation sputtering target

Sputtering targets evaporation materials deposition materials thermal evaporation electron beam evaporation sputtering target

Sputtering targets evaporation materials deposition materials thermal evaporation electron beam evaporation sputtering target